Although the equipment of pulsed
laser deposition (PLD) system is simple, its working mechanism is related to
many complicated physical phenomena. It includes all physical interactions
between the laser and the substance when the high-energy pulsed radiation
strikes the solid target, the formation
of plasma plumes and the transfer of the molten material through the plasma
plume to the surface of the heated substrate. Therefore, PLD can generally be
divided into the following three stages:
Interaction
between laser radiation and the target
In this stage, the laser beam is focused on
the surface of the target. When sufficient high energy flux and short pulse
width are achieved, all elements of the target surface are rapidly heated to
the evaporation temperature. At this point, the material in the target will be
sputtered from the target. The instantaneous melting rate of the target is
highly dependent on the flow of laser light onto the target. The melting
mechanism involves many complex physical phenomena such as collisions, heat,
excitation with electrons, delamination, and fluid mechanics.
Dynamics
of molten matter
In the second stage, according to the law
of aerodynamics, the sputtered particles have a tendency to move toward the
substrate. The space thickness varies with the function cosn θ, and n>>1.
The area of the laser spot and the temperature of the plasma have an important
influence on the uniformity of the deposited film. The distance between the
target and the substrate is another factor that affects the angular extent of
the molten material. It has also been found that placing a baffle close to the
substrate narrows the angular extent.
Deposition
of molten material on the substrate
The third stage is the key to determining
the quality of the film. The high-energy nuclides emitted hit the surface of
the substrate and may cause various damages to the substrate. The high energy
nuclide sputters some of the atoms on the surface, and a collision zone is
established between the incident stream and the sputtered atoms. The film is
formed immediately after the formation of this thermal energy zone (collision
zone), which is the best place to condense particles. As long as the
condensation rate is higher than the release rate of the sputtered particles,
the heat balance condition can be quickly reached, and the film can be formed
on the surface of the substrate due to the weakened flow of the molten
particles.
Please visit https://www.sputtertargets.net/ for
more information.
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